| URN | etd-0804111-161024 | Statistics | This thesis had been viewed 736 times. Download 7 times. |
| Author | Yi-Chia Liao | ||
| Author's Email Address | fun334.tw@msa.hinet.net | ||
| Department | Institute of Mechatronic Engineering | ||
| Year | 2010 | Semester | 2 |
| Degree | Master | Type of Document | Master's Thesis |
| Language | zh-TW.Big5 Chinese | Page Count | 140 |
| Title | The study on the corrosion resistance of Zr-based metallic glass thin films prepared by the pulsed DC magnetron sputter system | ||
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| Abstract | The Zr-based thin film metallic glasses (TFMGs) were co-deposited on Si and SUS420 substrates using a Zr-Cu-Ni-Al alloy and pure Zr metal targets by a pulsed DC magnetron sputtering system. The chemical compositions, crystalline structures, microstructures and hardness of Zr-based TFMG were investigated. The corrosion behavior of Zr-based TFMG in hydrochloric and sulfuric acid aqueous solutions was evaluated by a potentiodynamic polarization test. And the cyclic voltammetry test was executed in 1mM HCl aqueous solution by using an electrochemical atomic force microscope (ECAFM). The results showed that the surface morphologies of Zr-based TFMG were very smooth, and a high hardness value was found for the Zr-based TFMG. According to cross-section images, a compact and dense structure without columnar structures was observed. The amorphous structure of Zr-based TFMG was characterized by the XRD and TEM analyses. After potentiodynamic polarization test, the better corrosion resistance was achieved for Zr-based TFMG coated on SUS420 in 1mM HCl aqueous solution. Based on the surface morphology of the corroded surface, it was found that the corrosion mechanisms of Zr-based metallic glass thin films included pitting, crevice and filiform corrosions. After the cyclic voltammetry tests, the dendritic Cu crystallites, cuprous oxide and cuprous chloride particles mixture were found on the surface of Zr-based TFMG. Key words: Zr-based TFMG, filiform corrosion, crevice corrosion, amorphous, magnetron sputtering, electrochemical |
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| Advisor Committee | |||
| Files | indicate accessible at a year | ||
| Date of Defense | 2011-07-25 | Date of Submission | 2011-08-08 |