| URN | etd-0804110-141303 | Statistics | This thesis had been viewed 827 times. Download 11 times. |
| Author | Chia-lin Wu | ||
| Author's Email Address | No Public. | ||
| Department | Institute of Mechatronic Engineering | ||
| Year | 2009 | Semester | 2 |
| Degree | Master | Type of Document | Master's Thesis |
| Language | zh-TW.Big5 Chinese | Page Count | 123 |
| Title | Shape Optimization of Contact Springs Used in KeyStone Jacks |
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| Abstract | Abstract Gold-plated wires are one of the major components composing the network connectors that are known as the RJ-45 connectors. This research employs the finite element analysis and response surface method with a modified power transformation technique to perform the sizing optimization for the wires. This study also analyzes the stress and strain of the wires when a connector is inserted into a socket, and investigates the sizing effects of the wires on the contact performance. During the insertion process, contact springs formed by bended gold-plated wires inside the socket are brought into contact and stay in contact with the plug, and deformed. Repeated insertion and unplugging may cause the contact springs to fatigue, especially in the bended areas, and lead to a reliability problem. This thesis combines ANSYS software with MATLAB programs to study the shape optimum design for the contact springs. The solid model for the contact springs is first built and then parameterized to create the finite element model for analysis. Based on the analysis results and experimental design, the response surface method is used repeatedly to achieve the minimum strain design with the contact forces remained within constraint limits. The contact springs with the optimized shape are expected to improve the reliability of the network connectors. Keywords: gold-plated wire, contact spring, RJ-45, finite element analysis, response surface method, shape optimization, power transformation |
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| Files | indicate in-campus access at 3 years and off-campus access at 3 years | ||
| Date of Defense | 2010-07-06 | Date of Submission | 2010-08-05 |