Title page for etd-0731109-213053


URN etd-0731109-213053 Statistics This thesis had been viewed 854 times. Download 11 times.
Author Jih-Ting Chen
Author's Email Address pooh6127@yahoo.com.tw
Department Institute of Mechatronic Engineering
Year 2008 Semester 2
Degree Master Type of Document Master's Thesis
Language zh-TW.Big5 Chinese Page Count 121
Title The Influence of fabrication parameters and copper contents on the antibacterial effects of Cr-Cu-N nanocomposite thin films
Keyword
  • Inhibition ring test
  • Cr-Cu-N nanocomposite thin films
  • bipolar asymmetry reactive pulsed DC sputtering
  • Antibacterial test
  • Antibacterial test
  • bipolar asymmetry reactive pulsed DC sputtering
  • Cr-Cu-N nanocomposite thin films
  • Inhibition ring test
  • Abstract The Cr-Cu-N nanocomposite thin films were deposited on SUS304 substrates surface using bipolar asymmetry reactive pulsed DC sputtering system. By changing the substrate temperature, substrate bias and substrate surface roughness, various Cr-Cu-N composite films with a gradient copper content were prepared. In this study, inhibition zone tests and antibacterial tests were adopted to evaluate the effect of copper content and surface roughness on the antibacterial abilities of Cr-Cu-N coatings.
    It is shown that the Cr-Cu-N thin films have obvious antibacterial effects on the E. Coli and Staphylococcus. A better antibacterial rate is found on the Cr-Cu-N coating containing higher Cu contents. The antibacterial ability of thin film is related to the releasing of Cu atoms. The width of the inhibition ring is very clear on the coatings sterilized by UV light. The ring width increases with increasing Cu content of the coating. On the other hand, a dark ring with ambiguous width is observed on the coatings sterilized by autoclave. It is believed that the shape of the inhibition ring is related to the
    contamination during the UV light sterilization process.
    In addition, the Cu content of each Cr-Cu-N thin film decreases drastically after the inhibition ring test and Cu releasing test. It is suggested that the copper atoms reacting with the sulfur and chlorine ions in the Mueller-Hinton agar to form particles on the surface of Cr-Cu-N thin film is the main reason for the depletion of Cu content in the Cr-Cu-N coating.
    Advisor Committee
  • Jyh-Wei Lee - advisor
  • none - co-chair
  • Yu-Jie Chang - co-chair
  • Files indicate in-campus access at 3 years and off-campus access at 3 years
    Date of Defense 2009-07-20 Date of Submission 2009-07-31

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