| URN | etd-0726116-144315 | Statistics | This thesis had been viewed 362 times. Download 1 times. |
| Author | Chao-wei Chen | ||
| Author's Email Address | sss85069@yahoo.com.tw | ||
| Department | Institute Of Mechanical Engineering | ||
| Year | 2015 | Semester | 2 |
| Degree | Master | Type of Document | Master's Thesis |
| Language | zh-TW.Big5 Chinese | Page Count | 134 |
| Title | Study of micro structure and mechanical properties of copper thin-film plated on the surface of ABS plastic | ||
| Keyword | |||
| Abstract | In this study the thickness, quality, surface micro-structure, and surface topography of copper thin-film micro-plated on poly acrylonitrile ¡V butadiene - styrene (ABS) substrate has been analyzed for in-depth investigation of their impacts on mechanical properties. The MAKERBOT-ABS white plastic disc with outer diameter of 20mm and thickness of 1mm is used as the specimen of ABS plastic plating with the mass of 0.3 g after the 10 mm long 1 mm wide area for hanging the copper wire within the circle is excluded. The surface of plastic substrate, which was originally an insulator, is metalized by plastic plating to generate a layer of conductive thin-film. The plastic plating is carried out based on the main parameters of plating time, sensitization treatment time, current density, and temperature of plating solution. The plated ABS plastic specimen is observed and analyzed by Scanning Electron Microscope (SEM) to measure the thin-film thickness and surface topography, while the 2D¡E3D profiler of surface roughness measurement (SRM) is used for 2D surface roughness measurement, and the X-ray Diffractometer is used for observing the crystalline structure and lattice parameters. In the end the parameters with the optimal performances are analyzed in accordance with the results of various mechanical property tests. The result of this study indicates that the optimal film thickness for the impact of plating solution on film thickness and mass is 0.09mm with mass of 0.15g, the optimal film thickness for the impact of plating time on film thickness and mass is 0.03mm with mass of 0.2g, the optimal film thickness for the impact of current density on film thickness and mass is 0.22mm with mass of 0.8g, and the optimal film thickness for the impact of sensitization time on film thickness and mass is 0.25mm with mass of 1.72g. |
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| Files | indicate in-campus access at 5 years and off-campus access at 5 years | ||
| Date of Defense | 2016-07-13 | Date of Submission | 2016-07-30 |