| URN | etd-0726113-131109 | Statistics | This thesis had been viewed 450 times. Download 5 times. |
| Author | Cheng-Han Zhou | ||
| Author's Email Address | gvi43918@yahoo.com.tw | ||
| Department | Institute Of Mechanical Engineering | ||
| Year | 2012 | Semester | 2 |
| Degree | Master | Type of Document | Master's Thesis |
| Language | zh-TW.Big5 Chinese | Page Count | 78 |
| Title | Characteristics of alumina material processed by electrochemical discharge machining | ||
| Keyword | |||
| Abstract | In this study, electrochemical discharge machining (ECDM) is applied to processing of alumina material. ECDM is a commonly used non-traditional processing technique. It is not affected by the mechanical properties of the workpiece and is well suited for machining materials of high hardness, toughness and strength. ECDM involves high-temperature melting and accelerated chemical etching under the high electrical energy discharged on the electrode tip during electrolysis for material removal. The workpiece in this study is made of alumina (Al2O3), which is known to possess good mechanical strength, high corrosion and wear resistance as well as high electrical insulation. The effects of various parameters including applied voltage, mole concentration, spindle rotational speed, and discharge frequency on processing efficiency and surface roughness are examined to determine the optimal machining conditions. Surface morphologies are observed using white light interferometer and scanning electron microscopy (SEM). Experimental results show that the optimal machining conditions are applied voltage, 85 V; phosphate mole concentration, 10 M; spindle rotational speed, 1000 rpm; and discharge frequency, 1k. ECDM with a 200-£gm-diameter electrode under such conditions for 30 min achieves the minimum hole enlargement in the alumina workpiece, yielding a hole diameter of 224 £gm with a smooth surface profile. |
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| Files | indicate in-campus access at 3 years and off-campus access at 5 years | ||
| Date of Defense | 2013-07-10 | Date of Submission | 2013-07-29 |