| URN |
etd-0719111-121616 |
Statistics |
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|
| Author |
Jyh-Hsuan Lee |
| Author's Email Address |
No Public. |
| Department |
Institute of Mechatronic Engineering |
| Year |
2010 |
Semester |
2 |
| Degree |
Master |
Type of Document |
Master's Thesis |
| Language |
zh-TW.Big5 Chinese |
Page Count |
72 |
| Title |
Experiment and simulation of thermal analysis for the high power electronic element at low flowrate with the liquid cooling system of tiny flow channel |
| Keyword |
tiny flow channel
liquid cooling heat sink
flow design
flow design
liquid cooling heat sink
tiny flow channel
|
| Abstract |
This study investigates the flow field design and the thermal solution of the high power heating element by the tiny flow channel cooling system. Heat was impacted directly by water liquid to go through the tiny flow channel of the cooling system and dissipated. The contact area ratio r is 1, 17.54, 38.92 respectively, and the flow rate Q is the0.1~0.5 L/min respectively in the experiments of the heat flux in the range of 2.974 ~ 5.354 W/cm2. By the control parameters are height lift of 28, 38, 48, 58cm respectively and different volume flow, the experiments show the much better cooling effect at contact area ratio r = 38.92 under the condition of the same volume flow and at geometry parameter r = 38.92 under the condition of the same height lift. This result shows the tiny flow channels can promote the cooling effect. This investigation also uses the I-DEAS software to analysis the flow and thermal fields of the tiny flow channel liquid cooling system. The results compared with the practical experimental are not so significant. |
| Advisor Committee |
Feng-Chin Tsai - advisor
Jeng-Pon Wu - co-chair
Ren-Horn Hsieh - co-chair
|
| Files |
indicate in-campus access at 2 years and off-campus access at 2 years |
| Date of Defense |
2011-06-28 |
Date of Submission |
2011-07-19 |
