Title page for etd-0718114-161149


URN etd-0718114-161149 Statistics This thesis had been viewed 594 times. Download 4 times.
Author CHIH-WEI WANG
Author's Email Address shoop0830@gmail.com
Department Institute Of Mechanical Engineering
Year 2013 Semester 2
Degree Master Type of Document Master's Thesis
Language zh-TW.Big5 Chinese Page Count 71
Title The study on the fabrication of gaphene thermal compound
Keyword
  • gaphene
  • thermal compound
  • thermal conductivity
  • PDMS.
  • PDMS.
  • thermal conductivity
  • thermal compound
  • gaphene
  • Abstract ¡@This study used the graphene with base oils and successful production of graphene thermal compound, and constructed a good thermal detector for measuring the thermal resistance of thermal paste. After experiments, the produced graphene thermal compound is indeed quite excellent thermal effect, its effectiveness and stability are inferior to the commercially available thermal compound product, the highest thermal conductivity up to 7.369 W / mK.
    ¡@The study also found that the following phenomenon: the appropriate concentration of graphene thermal compound is the weight percentage of 30%, while increasing the amount of content is too low, thermal conductivity is not obvious; when the content is too high, but lower thermal conductivity. Importing sonication in the production process of the thermal compound, can effectively disperse the oil and basic materials, and increase the uniformity of thermal compound and increase the thermal conductivity. In the base oil, the olive oil has a better compatibility with graphene than PDMS, which enhance the thermal conductivity of 16%. In the dispersant, the use of isopropyl alcohol than the thermal conductivity improved by 31%. Therefore, graphene dispersion directly affects the heat conduction effect. Also proposed is different from the commercially available thermal compound, this research process is quite simple, just a few steps that can make a very high thermal conductivity thermal compound, so this study should have good thermal compound technical contribution.
    Advisor Committee
  • Jen-Ching Huang - advisor
  • Feng-Chin Tsai - co-chair
  • none - co-chair
  • Files indicate in-campus access at 3 years and off-campus access at 3 years
    Date of Defense 2014-07-07 Date of Submission 2014-07-21

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