| URN | etd-0718114-135300 | Statistics | This thesis had been viewed 532 times. Download 19 times. |
| Author | Kuan-Hwa Chin | ||
| Author's Email Address | peterandgary@yahoo.com.tw | ||
| Department | Institute Of Mechanical Engineering | ||
| Year | 2013 | Semester | 2 |
| Degree | Master | Type of Document | Master's Thesis |
| Language | zh-TW.Big5 Chinese | Page Count | 82 |
| Title | Characteristics of alpha-Al2O3 ceramic processed by electrochemical discharge machining | ||
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| Abstract | In this study, Electrochemical Discharge Machining (ECDM), a non-traditional but commonly used processing technique, is applied to processing of alumina material. The alumina material used is alpha-Al2O3 ceramic of more than 99.9% purity sintered under temperature of 1650-1990¢J and has a transmission wavelength of 1-6 £gm. Its good light transmittance and high corrosion resistance render it an ideal material for making sodium lamps. It is also used in electronic industry for making integrated circuit board and for high-frequency insulation because of its superior mechanical strength, strong erosion and abrasion resistance, and high electrical insulation properties. Experiments were conducted using tungsten electrodes of 200 £gm diameter at various applied voltages, mole concentrations and spindle speeds. Changes in ECDM efficiency of alpha-Al2O3 ceramic under different parameter settings were examined using a white light interferometer and the variations in surface morphology were observed with a scanning electron microscope. Experimental results show that a minimum hole diameter of 200 £gm can be obtained under the optimal machining conditions of applied voltage, 85 V per minute gradually increased to 105 V in 20 minutes; mole concentration of phosphoric acid, 5M, and spindle speed, 1000 rpm. Moreover, EDM performed under magnetic assistance and with hydrochloric acid can achieve greater machining depth of 101.8 £gm and a more flat bottom. |
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| Files | indicate access worldwide | ||
| Date of Defense | 2014-07-11 | Date of Submission | 2014-07-18 |