| URN | etd-0707120-212313 | Statistics | This thesis had been viewed 201 times. Download 2 times. |
| Author | Chia-Sheng Hsu | ||
| Author's Email Address | No Public. | ||
| Department | Institute Of Mechanical Engineering | ||
| Year | 2019 | Semester | 2 |
| Degree | Master | Type of Document | Master's Thesis |
| Language | zh-TW.Big5 Chinese | Page Count | 76 |
| Title | Using Taguchi Method to Discuss Gold Wire in IC Packaging Process ptimization of bump bonding parameters | ||
| Keyword | |||
| Abstract | This article mainly discusses the die-to-die wire bonding technology BUMP BOND (ball bumping) in the IC packaging wire bonding process, use the Taguchi method to find the best 0.96 mil gold wire (bump bond) wire bonding parameters, increase yield and improve product reliability. This article first uses the Taguchi quality method factor map to find out the four control factors that affect the process of bump ball bonding process, including: bump bond power, bump bond force, bump bond time and bond site temperature, and discusses the optimized design of the process parameters of the 0.96 mil gold wire bump bonding process. Multiple sets of experiments to change the control factor are used to record the bump bond ball shear value, the bump bond ball shear value and the wire pull value of the soldered second bond joint, and then optimize the combination of parameters by the S\N ratio analysis of Taguchi quality method. Finally, the optimized combination parameters were used for experimental verification, and the average value of the ball shear was indeed increased by 12%, and the ball shear value of the second bond joint ball can be effectively improved, Increase the process capability index Cpk to A ++ level, and have the desired ball shear value and wire pull value. This article can be used as a reference for the adjustment direction and adjustment range of the gold wire bump bonding process parameters. |
||
| Advisor Committee | |||
| Files | indicate in-campus access at 2 years and off-campus access at 2 years | ||
| Date of Defense | 2020-07-02 | Date of Submission | 2020-07-13 |