| URN | etd-0122110-123609 | Statistics | This thesis had been viewed 795 times. Download 15 times. |
| Author | Ching-Hsi Chou | ||
| Author's Email Address | aasd168@yahoo.com.tw | ||
| Department | hazards | ||
| Year | 2009 | Semester | 1 |
| Degree | Master | Type of Document | Master's Thesis |
| Language | zh-TW.Big5 Chinese | Page Count | 194 |
| Title | Impedance Properties of Paste Incorporating with Silica Fume and Waterproof Material | ||
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| Abstract | Impedance Properties of Paste Incorporating with Silica Fume and Waterproof Material Student¡GChing-Hsi Chou Advisor¡GPing-Ju Lin Graduate School of Technology for Hazards Mitigation Tung Nan University ABSTRACT This paper is to study the engineering properties of cement paste with silica fume and waterproof material addition, using AC impedance and Vicat needle penetration. The research including the setting time and the impedance behavior of cement paste incorporating with silica fume and waterproof material is implemented. The results shows that the higher water-to-binder ratio, the higher initial and final setting time of paste; with the increase in silica fume and waterproof material addition, the initial and final setting time of paste decreases. At a fixed-frequency (10 kHz), the impedance value of silica fume and waterproof material paste increases with increasing curing age. The impedance value of paste increases with increasing addition of silica fume and waterproof material at 28-d age. From Nyquist plots of silica fume and waterproof material pastes, the impedance values of silica fume and waterproof material pastes increase with increasing curing age. By equivalent circuit simulation of silica fume and waterproof material pastes, the analysis of equivalent circuit model with interface effect is more accurate than that without interface effect. Keywords: AC impedance, Silica fume, Waterproof material,Equivalent circuit plot |
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| Files | indicate in-campus access immediately and off-campus access at one year | ||
| Date of Defense | 2010-01-15 | Date of Submission | 2010-01-23 |